Composition of PCB Reflow Soldering Oven
From: Author:PCB Reflow Soldering Oven Publish time:2020-06-29 15:54 Clicks:217
Composition of PCB Reflow Soldering Oven
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1. Computer control system. The computer control system is the center of the reflow furnace. The quality of the selected components, the operation mode, the flexibility of the operation and the functions it has directly affect the use of the equipment. The computer control system uses PLC (programmable logi ccontroller, programmable controller) as the main control unit to monitor the work of the entire reflow furnace
2. Heating system. The function of the heating system is to heat the PCB board from room temperature to the melting of the solder paste. The heating system of the full hot air reflow furnace mainly includes motor, heating tube, wind wheel, rectifier plate and other parts
3. Cooling system. In reflow soldering, the final process that the PCB board goes through is cooling. The role of the cooling system is to cool the temperature of the PCB board below the solid phase temperature, so that the solder joints solidify.
4. PCB board transmission system. The function of the PCB board conveying system is to transmit the PCB board from the inlet to the outlet of the reflow furnace at a certain transmission speed. Including mesh belt, chain, rail
5. Nitrogen system. In order to prevent oxidation and increase wettability, the current reflow soldering often requires nitrogen protection, generally requiring an oxygen concentration below 1000 ppm
6. Electrical system. The electrical system of the reflow furnace is the general term for all mechanical and electrical devices in the equipment. It is controlled by the computer control system. The most typical devices are relays, air switches, etc.
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