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Because Sony’s lead-free profile requires a rapid ramp-up from the 160-180°C plateau to the 235°C plateau, it became necessary for boards to move from a 180°C soak zone to a 290°C ramp-up zone and then into a 235°C reflow zone. In a forced convection oven, characterized by continuous air movement, maintaining separate zones at different temperatures in close proximity to each other poses a significant engineering challenge.
The breakthrough technology that was developed to manage the air flow made it possible for Sony’s lead-free profile to be maintained with consistency.
A nine-zone configuration within the reflow oven ensures the tight gas flow circulation management needed to maintain a consistent lead-free profile.
A high-efficiency ball bearing motor designed for a maximum operating temperature of 450°C helps maintain the very low DT required for lead-free reflow.
Another key breakthrough in maintaining tight temperature control was the deve lopment of a shorter Center Board Support (CBS) to eliminate thermal interference and prevent board warpage. In typical ovens, the CBS can block the air flow and affect the DT on the board, requiring a special profile to accommodate its use. By reducing the ength of the CBS to only those high-temperature zones where boards are most likely to warp, and to the cooling zones, it became possible to maintain the low DT without requiring a special profile.
Innovative thinking also led to a new approach to flux removal that eliminated the need for filters. The new system uses a condensation/precipitation methodology to remove flux from the oven tunnel before it reaches the cooling area, where it tends to accumulate in conventional ovens. The flux is trapped in a series of trays and concentrated into a molasses-like substance through a self-cleaning cycle that operates automatically during production. It is completely transparent to the user and requires no downtime.
An innovative flux collection system for air reflow includes dual internal and external exhausts.
A Center Board Support that spans only high-temperature zones eliminates the need for a special profile to prevent board warpage.
After 30 days of processing using 56.0 kg of solder paste, the condenser tubes in the flux collection system show significant flux accumulation.
The trays have a capacity of approximately a year’s worth of flux, at a production rate of two kilos per day of paste usage. When the trays fill up, they can be removed and replaced or removed, cleaned and returned to the oven. The replacement process can be
completed in ten minutes, once a year, as opposed to the several-hour-long monthly procedure required for filter exchange. Several of Sony’s new reflow ovens have been runFollowing a 20-minute
To meet Sony’s final requirement of a reduced footprint, the ovens were reconfigured to contain a larger number of smaller zones within a 150-inch length, yet still equal the throughput of a conventional 183-inch oven. The result was a 20% increase in throughput per linear foot, an important space-saving consideration. An added bonus was the translation of all oven software into Japanese, for greater ease of use by operators and engineers alike.
The process of developing new reflow technology for Sony required months of close partnership between supplier and manufacturer, but has resulted in benefits for both parties. The Kohda division of Sony has achieved its goal of implementing a green manufacturing operation with lead-free soldering and flux-free emissions, while maintaining or enhancing throughput. The oven supplier has developed engineering advances in reflow technology that may be extended throughout the industry as more electronics manufa cturers realize the market value of instituting more environmentally friendly assembly processes.
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