I.C.T Senior Engineer Tell You How to Choose the Reflow Oven -- Chapter 4
From: Author:Reflow Oven Publish time:2020-06-08 14:38 Clicks:47
I.C.T Senior Engineer Tell You How to Choose the Reflow Oven -- Chapter 4
Highly flexible Nitrogen reflow soldering oven, rapid cooling function, external water cooler.
Some SMT turn key supplier make SMT solution to you, they always ask you about the PCB size and the production capacity. About the capacity, most engineer will calculate how many your component on your PCB, and compare with the speed of pick and place machine. Then they will give you a solution.
But there are another important factor of capacity: reflow oven chain speed.
In chapter 1, I mentioned about the reflow oven chain speed, because the time of flux in solder paste is constant, so the chain speed also is a constant. If you heard from other engineers who tell you the chain speed can be adjusted by yourself freely, they must be not professional.
Here to share a calculation formula of capacity:
Capacity = PCB Length * 60sec / Chain Speed
Chain Speed = Heat Zones Length / Cross Time
According to this formula, we can find which factors affact the capacity.
The cross time is constant, because the flux melt time it constant, so the heat zones length is longer, the chain speed is higher, so that the capacity is higher.
So you will know if you buy a 10 zones reflow oven, the capacity is higher than 8 zones reflow oven.
If I.C.T senior engineer make SMT turn key solution to you, we have three steps:
1. We will calculate how many time mount the chip on one PCB board.
2. According to the speed and time, we can calculate which chip mounter and how many is suitable.
3. Base on the capacity, we can recommend you will use the 8 zones or more.
❙ Reflow Soldering Oven Video