Reflow Oven | Surface Mount Technology
From: Author:Reflow Oven Publish time:2019-06-21 14:59 Clicks:76
❙ Reflow Oven | Surface Mount Technology
Reflow oven, SMT reflow oven, reflow sodlering is the most widely used method of attaching surface mount components to printed circuit boards (PCBs). The aim of the process is to form acceptable solder joints by first pre-heating the components/PCB/solder paste and then melting the solder without causing damage by overheating.
SMT is a surface mount technology (short for Surface Mounting Technology) called surface mount or surface mount technology. It is currently the most popular technology and process in the electronics assembly industry.
It is a surface-mounting component (SMC/SMD, Chinese called chip component) that is packaged in a matrix of leadless or short leads or balls, mounted on the surface of a Printed Circuit Board (PCB) or On the surface of other substrates, the circuit assembly technique of soldering is performed by means of reflow soldering or dip soldering.
We offer first-class SMT equipment: SMT line, SMT printer, SPI, pick and place machine, AOI, reflow oven, PCB handling equipment; DIP equipment: DIP insertion line, wave soldering machine, assembly line, belt line), test equipment, packaging equipment, etc. .
❙ Reflow Oven Video