Flux-Free Formic Reflow Soldering

Flux-Free Formic Reflow in Formic Acid Vapor

I.C.T has designed and built a production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor soldering. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases).

Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow

Excellent results demonstrated for wafer bumping application in horizontal reflow oven

Fluxless reflow utilizes gas phase Formic Acid (HCOOH) to replace standard fluxing agents

Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps

No post-reflow flux clean facilitates inline application of epoxy and inline epoxy curing solution

Feasibility has been demonstrated with production grade oven

Extensive engineering efforts in safe, precision delivery of formic acid and abatement

Flux-Free Formic Reflow Advantages

Can use any reflow profile (e.g., tent or soak profile) with formic acid

Can adjust formic acid profile in oven in conjunction with thermal reflow profile

Includes Formic acid safety system (i.e., sensors/detectors) adheres to industry standards

Includes Formic acid abatement systems for Green Process Solution

Includes real time formic acid concentration monitor system

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