Vacuum Applications

Convection reflow systems utilize a vacuum module that inserts directly in its reflow oven line

Reflow liquidous can be achieved before or after entering a vacuum module

Vacuum module is inserted in a zone where reflow peak typically occurs

Alternatively, reflow liquidous can be achieved inside the vacuum module through IR heating

Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications

Continuous operation facilitates low cost of ownership (COO) and high UPH

Vacuum Soldering Overview

Vacuum-assisted reflow through the inclusion of a vacuum module in its reflow oven line is now standard technology

Vacuum-assisted reflow with convection heating utilizes continuous

operation thermal profiles for low COO and high UPH.

 Recent customer installation showed 10X reduction in voids, meeting

specification of <1% total void area

Reflow time under a vacuum of 15 seconds was able to achieve <1% total void area specification

All pressures tested < 20 Torr met <1% total void area specification

A major issue and concern with vacuum reflow is solder splatter. If the vacuum pressure is reduced too quickly solder balls can be “splashed” across the substrate. I.C.T has developed a multi-stage step-down algorithm that is computer controlled and can be customized for your process -- thus eliminating solder splatter on the product. 

A user-friendly GUI makes this easy to set up. The user-friendly software package has many “knobs” to control the purge down process as well as timing for each phase of the thermal excursion. Including:

Conveyor speed into the chamber

Conveyor speed on exiting the chamber

Residence time in the chamber

Temperature in the chamber

Refill time

Refill rate 

 

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