Vacuum Soldering Systems

Voids will be reduced up to 99%, solder joints quality optimized

Double sided PCBs

Suitable for PCBs, DCB, stamping grid and carrier

Setting Parameter: evacuation time; vacuum hold time; ventilation time; vacuum pressure

Only one sealing surface of the vacuum chamber

"Vacuum Plus" is a system for improving quality of solder joints. Voids are reduced in a vacuum chamber which significantly improves the quality of the soldered product.

Vacuum Soldering

Reduction of voids in the solder joint results in:

Increased thermal conductivity

Low component temperature

Increased durability of components 

In high-frequency applications the width of impedance  of the solder joint is optimized (narrow). The vote performance of the components is thereby simplified.

The solder of the component is melted, the component goes in the vacuum chamber via the inline conveyor system. Because of the vacuum application voids will be sucked out of the solder joint. Process parameter are adjustable: evacuation, holding and venting time as well as reached vacuum. Then the component goes into the cooling zone where the solder is solidified.

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