What is I.C.T SMT Reflow Oven Heating Method

 

1. Full hot air SMT reflow oven

All hot air SMT reflow oven is a soldering method that uses a convection nozzle or a heat-resistant fan to force the airflow to circulate so as to be heated by the parts. This type of equipment began to emerge in the 1990s. Because the temperature of the printed board (PC8) and components using this heating method is close to the gas temperature in the given heating temperature zone, it completely overcomes the local temperature difference and shielding effect of infrared reflow soldering oven, so it is currently widely used. The convection speed of the circulating gas in the all-hot air SMT reflow soldering oven equipment is very important. In order to ensure that the circulating gas acts on any area of the printed board, the airflow must have a sufficiently fast speed, which to a certain extent easily causes the jitter of the printed board and the displacement of the components. In addition, the heat exchange efficiency of this heating method is lower and consumes more power.

2. Infrared hot air SMT reflow oven

This type of SMT reflow oven is based on the infrared furnace with hot air to make the temperature in the furnace more uniform. It is currently the more ideal heating method. This type of equipment makes full use of the characteristics of strong infrared penetration, high thermal efficiency and power saving, and effectively overcomes the local temperature difference and shielding effect of infrared reflow soldering during the hole and makes up for the impact of hot air SMT reflow soldering oven machine on the gas flow rate. This reflow soldering is currently the most commonly used.

❙ SMT Reflow Soldering Oven Video