Working Principle of Reflow Soldering Oven Machine

 

The primary use of reflow soldering oven is in the SMT process. In the SMT process, the primary effect of reflow soldering oven is to place the PCB board with components placed in the track of the reflow soldering machine, after heating, heat preservation, welding, cooling, etc. The solder paste is changed from paste to liquid at high temperature, and then to solid after cooling, and then the effect of soldering the electronic components and the PCB board is completed. The core part of the reflow oven is to use an external heat source to heat, melt the solder and flow again to complete the soldering process of the circuit board.

There are four main temperature zones in the furnace of the reflow soldering machine: heating zone, constant temperature zone, welding zone and cooling zone. This also reflects the change process of the solder paste on the circuit board where the components are mounted in the reflow soldering machine.

A. When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate. At the same time, the flux in the solder paste wets the pad, component ends and pins, the solder paste softens, collapses, and covers the solder Plate to isolate the pad and component pins from oxygen.

B. When the PCB enters the heat preservation area, the PCB and components are fully preheated to prevent the PCB from suddenly entering the soldering high temperature area and damaging the PCB and components.

C. When the PCB enters the soldering area, the temperature rises rapidly to make the solder paste melt, and the liquid solder wets, diffuses, diffuses or reflows the PCB pads, component ends and pins to form solder joints.

D. The PCB enters the cooling zone to solidify the solder joints, and the reflow soldering is completed at this time.

❙ SMT Reflow Soldering Oven Video