Reflow Oven Machine Production Process

 

Reflow oven machine production process parameter setting: reflow soldering temperature parameter setting (lead and lead-free), reflow soldering chain speed parameter setting.

1. The setting of reflow oven temperature parameters is divided into solder paste (with or without lead), red glue scheme reflow soldering temperature parameters

2. The setting of the process parameters of the conveyor belt speed (chain speed) of the reflow soldering oven:

3. The speed setting of the conveyor belt is the first parameter considered for the temperature curve. This parameter determines the time the PCB spends in the heating zone.

4. The speed of the conveyor belt is equal to the length of the heating zone (total length of the reflow oven minus the length of the inlet and cooling zone) divided by the heating temperature time. (For example, assuming that the total length of the heating zone is 180 cm and the heating time is 4 minutes, then the transmission speed is 45 cm / min. (180 cm / 4 ’”).

5. According to the following process parameter settings, the transmission speed can be slightly adjusted to make the temperature curve parameters of the red glue and solder paste meet the inherent parameters of the red glue and solder paste products. Data).

❙ SMT Reflow Oven Machine Video